Category Archives: 1.TestProbe

1.TestProbe-Package08-PinGridArray

Posted on March 31, 2009 by admin

Burn In Test ProbePackage #08: Pin Grid Array(N-PGA).Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #07: Small Outline JLead(M-SOJ).Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #06: Small Outline IC(K-SOIC).Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #05: PLASTIC LEADLESS CHIP CARRIER (J_PLCC). Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage#04: Leadless Chip Carrier (H-LCC).Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #03: D-TO.Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #02: FLATPACK (C_FP).Product Pictures To request for more specification, please contact us here.

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Posted on March 31, 2009 by admin

Burn In Test ProbePackage #01: DUAL IN LINE01(A_DIP). Product Pictures To request for more specification, please contact us here.

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