Category Archives: 1.TestProbe
V2TP08: LEADLESS CHIP CARRIER (LCC)
Burn In Test Probe Package #01: LEADLESS CHIP CARRIER (LCC).Product Pictures To request for more specification, please contact us here.
V2TP04: TO
Burn In Test ProbePackage #04: TO.Product Pictures To request for more specification, please contact us here.
V2TP03: FLATPACK (FP)
Burn In Test Probe Package #03: FLATPACK (FP).Product Pictures To request for more specification, please contact us here.
V2TP01: DUAL IN LINE 0.1″ (DIP)
Burn In Test Probe Package #01: DUAL IN LINE (DIP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package14-BallGridArray
Burn In Test ProbePackage #14: Ball Grid Array(Y_BGA).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package13-ThinSOP
Burn In Test ProbePackage #13: Thin SOP(V-TSOP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package12-TapeAutomatedBonding
Burn In Test ProbePackage #12: Tape Automated Bonding(U-TAB).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package11-CeramicLeadedChipPackage
Burn In Test ProbePackage #11: Ceramic Leaded Chip Package(T-CLCC).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package10-QualFlatPackage
Burn In Test ProbePackage #10: Quad Flat Package(S-QFP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package09-VerySmallQuadFlatPackage
Burn In Test ProbePackage #09: Very Small Quad Flat Package(R-VQFP).Product Pictures To request for more specification, please contact us here.