Category Archives: 1.TestProbe

V2TP22: BALL GRID ARRAYS (BGA)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #22: BALL GRID ARRAYS (BGA).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged ball grid arrays, bga package, test probe, y456-1, y48-0, y54-0 | Comments Off

V2TP19: THIN SOP (TSOP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #19: THIN SOP (TSOP).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged test probe, thin sop, tsop package, v32-6, v40-4, v40-5, v50-5 | Comments Off

V2TP18: TAPE AUTOMATED BONDING (TAB)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #18: TAPE AUTOMATED BONDING (TAB).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged tab package, tape automated bonding, test probe, u192-2, u256-1, u80-1 | Comments Off

V2TP17: CERAMIC LEADED CHIP PACKAGE (CLCC)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #17: CERAMIC LEADED CHIP PACKAGE (CLCC).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged ceramic leaded chip, clcc, t50-5, test probe | Comments Off

V2TP16: QUAD FLAT PACKAGE (QFP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #16 QUAD FLAT PACKAGE (QFP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged qfp package, quad flat package, s100-29, s100-46, s132-9, s136-1, s144-4, s160-19, s160-8, s208-8, s50-5, s64-16, s80-12, test probe | Comments Off

V2TP15: VERY SMALL QUAD FLAT PACKAGE (VQFP)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #15: VERY SMALL QUAD FLAT PACKAGE (VQFP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged r130-0, r176-0, r208-2, test probe, very small quad flat package, VQFP | Comments Off

V2TP12: PIN GRID ARRAY (PGA)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #12: Pin Grid Array (PGA).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged n84-1, pga, pga package, pin grid array, test probe | Comments Off

V2TP11: SMALL OUTLINE J LEAD (SOJ)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #11: SMALL OUTLINE J LEAD (SOJ).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged m16-1, m20-3, m28-0, m28-18, m32-1, m40-5, m40-6, small outline j lead, SOJ, test probe | Comments Off

V2TP10: SMALL OUTLINE IC (SOIC)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #10: SMALL OUTLINE IC (SOIC).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged k16-1, k16-3, k34-1, small outline IC, SOIC, test probe | Comments Off

V2TP09: PLASTIC LEADLESS CHIP CARRIER (PLCC)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #01: PLASTIC LEADLESS CHIP CARRIER (PLCC).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged j10-0, j100-0, j100-2, j12-1, j22-0, j22-2, j22-5, j28-4, j44-0, j44-1, j44-1m-2, j52-12, j68-0, j68-11, j68-15, j68-3, j68-5, j68-6, j84-0, leadless chip carrier, plcc package, test probe | Comments Off

Category Archives: 1.TestProbe

V2TP22: BALL GRID ARRAYS (BGA)

V2TP19: THIN SOP (TSOP)

V2TP18: TAPE AUTOMATED BONDING (TAB)

V2TP17: CERAMIC LEADED CHIP PACKAGE (CLCC)

V2TP16: QUAD FLAT PACKAGE (QFP)

V2TP15: VERY SMALL QUAD FLAT PACKAGE (VQFP)

V2TP12: PIN GRID ARRAY (PGA)

V2TP11: SMALL OUTLINE J LEAD (SOJ)

V2TP10: SMALL OUTLINE IC (SOIC)

V2TP09: PLASTIC LEADLESS CHIP CARRIER (PLCC)

Categories

Meta