Tag Archives: Burn in
1.TestProbe-Package14-BallGridArray
Burn In Test ProbePackage #14: Ball Grid Array(Y_BGA).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package13-ThinSOP
Burn In Test ProbePackage #13: Thin SOP(V-TSOP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package12-TapeAutomatedBonding
Burn In Test ProbePackage #12: Tape Automated Bonding(U-TAB).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package11-CeramicLeadedChipPackage
Burn In Test ProbePackage #11: Ceramic Leaded Chip Package(T-CLCC).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package10-QualFlatPackage
Burn In Test ProbePackage #10: Quad Flat Package(S-QFP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package09-VerySmallQuadFlatPackage
Burn In Test ProbePackage #09: Very Small Quad Flat Package(R-VQFP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package08-PinGridArray
Burn In Test ProbePackage #08: Pin Grid Array(N-PGA).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package07-SmallOutlineJLead
Burn In Test ProbePackage #07: Small Outline JLead(M-SOJ).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package06-SmallOutlineIC
Burn In Test ProbePackage #06: Small Outline IC(K-SOIC).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package05-PlasticLeadlessChipCarrier
Burn In Test ProbePackage #05: PLASTIC LEADLESS CHIP CARRIER (J_PLCC). Product Pictures To request for more specification, please contact us here.