Burn In Test Probe
Package #14: Ball Grid Array(Y_BGA)
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1.TestProbe-Package14-BallGridArray
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1.TestProbe-Package13-ThinSOP
Burn In Test Probe
Package #13: Thin SOP(V-TSOP)
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Tagged Burn in, SOP, test probe, thin
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1.TestProbe-Package12-TapeAutomatedBonding
Burn In Test Probe
Package #12: Tape Automated Bonding(U-TAB)
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1.TestProbe-Package11-CeramicLeadedChipPackage
Burn In Test Probe
Package #11: Ceramic Leaded Chip Package(T-CLCC)
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Tagged Burn in, ceramic, leaded chip package, test probe
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1.TestProbe-Package10-QualFlatPackage
Burn In Test Probe
Package #10: Quad Flat Package(S-QFP)
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1.TestProbe-Package09-VerySmallQuadFlatPackage
Burn In Test Probe
Package #09: Very Small Quad Flat Package(R-VQFP)
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Tagged Burn in, quad flat package, test probe, very small
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1.TestProbe-Package08-PinGridArray
Burn In Test Probe
Package #08: Pin Grid Array(N-PGA)
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1.TestProbe-Package07-SmallOutlineJLead
Burn In Test Probe
Package #07: Small Outline JLead(M-SOJ)
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Tagged Burn in, J Lead, small outline, test probe
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1.TestProbe-Package06-SmallOutlineIC
Burn In Test Probe
Package #06: Small Outline IC(K-SOIC)
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1.TestProbe-Package05-PlasticLeadlessChipCarrier
Burn In Test Probe
Package #05: PLASTIC LEADLESS CHIP CARRIER (J_PLCC)
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Tagged Burn in, leadless chip carrier, plastic, test probe
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