Burn In Test Probe
Package #12: Pin Grid Array (PGA)
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V2TP12: PIN GRID ARRAY (PGA)
Posted in 1.TestProbe, RU
Tagged n84-1, pga, pga package, pin grid array, test probe
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V2TP11: SMALL OUTLINE J LEAD (SOJ)
Burn In Test Probe
Package #11: SMALL OUTLINE J LEAD (SOJ)
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Tagged m16-1, m20-3, m28-0, m28-18, m32-1, m40-5, m40-6, small outline j lead, SOJ, test probe
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V2TP10: SMALL OUTLINE IC (SOIC)
Burn In Test Probe
Package #10: SMALL OUTLINE IC (SOIC)
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Tagged k16-1, k16-3, k34-1, small outline IC, SOIC, test probe
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V2TP09: PLASTIC LEADLESS CHIP CARRIER (PLCC)
Burn In Test Probe
Package #01: PLASTIC LEADLESS CHIP CARRIER (PLCC)
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V2TP08: LEADLESS CHIP CARRIER (LCC)
Burn In Test Probe
Package #01: LEADLESS CHIP CARRIER (LCC)
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Posted in 1.TestProbe, RU
Tagged h18-1, h18-3, h20-1, h28-8, h32-2, h32-3, h32-5, h32-8, h40-4, h44-3, h52-0, h68-5, lcc package, leadless chip carrier, test probe
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V2TP04: TO
Burn In Test Probe
Package #04: TO
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V2TP03: FLATPACK (FP)
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Package #03: FLATPACK (FP)
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Tagged c14-1, c20-5, c26-5, c30-2, c56-2, c68-2, flatpack, fp package, test probe
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V2TP01: DUAL IN LINE 0.1″ (DIP)
Burn In Test Probe
Package #01: DUAL IN LINE (DIP)
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Posted in 1.TestProbe, RU
Tagged a24-2, a40-2, dip package, dual in line, test probe
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New Multitest Contact Finger Ck1-441-00 added
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New Contact Finger and Test Sockets Update
Test Max is please to launch its new Contact Fingers and Test Sockets specially designed with the following features:
1) Small and Compact
2) Fine Pitch of 0.3mm with True kelvin included . High Current (17 Ampere @ 3mSec. >High, 200mSec >LOW)
3) Test Contact Resistance of 30mill Ohm.
4) Spacing of kelvin contact gap with min of 0.03mm.
5) Compression of contact pin can travel to 0.5mm.
Note: Johnstech and Johnstech logos are trademarks of Johnstech International (http://www.johnstech.com/). All rights reserved.
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