Contact Finger
Package #04: EMS
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V2CF04: EMS
Posted in 2.ContactFinger, RU
Tagged cd14-22, cd14-50, cd15-5, cd20-46, cd24-26, Contact Finger, ems, EMS Package
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V2CF03: TEXAS
Contact Finger
Package #03: TEXAS
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Posted in 2.ContactFinger, RU
Tagged cc14-1, Contact Finger, texas, TEXAS package
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V2CF02: VEHEM
Contact Finger
Package #02: VEHEM
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Posted in 2.ContactFinger, RU
Tagged cb-16-2, cb16-28, Contact Finger, vehem, vehem package
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V2CF01: MCT
Contact Finger
Package #01: MCT
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V2TP22: BALL GRID ARRAYS (BGA)
Burn In Test Probe
Package #22: BALL GRID ARRAYS (BGA)
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Posted in 1.TestProbe, RU
Tagged ball grid arrays, bga package, test probe, y456-1, y48-0, y54-0
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V2TP19: THIN SOP (TSOP)
Burn In Test Probe
Package #19: THIN SOP (TSOP)
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Posted in 1.TestProbe, RU
Tagged test probe, thin sop, tsop package, v32-6, v40-4, v40-5, v50-5
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V2TP18: TAPE AUTOMATED BONDING (TAB)
Burn In Test Probe
Package #18: TAPE AUTOMATED BONDING (TAB)
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Posted in 1.TestProbe, RU
Tagged tab package, tape automated bonding, test probe, u192-2, u256-1, u80-1
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V2TP17: CERAMIC LEADED CHIP PACKAGE (CLCC)
Burn In Test Probe
Package #17: CERAMIC LEADED CHIP PACKAGE (CLCC)
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Posted in 1.TestProbe, RU
Tagged ceramic leaded chip, clcc, t50-5, test probe
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V2TP16: QUAD FLAT PACKAGE (QFP)
Burn In Test Probe
Package #16 QUAD FLAT PACKAGE (QFP)
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Posted in 1.TestProbe, RU
Tagged qfp package, quad flat package, s100-29, s100-46, s132-9, s136-1, s144-4, s160-19, s160-8, s208-8, s50-5, s64-16, s80-12, test probe
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V2TP15: VERY SMALL QUAD FLAT PACKAGE (VQFP)
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Package #15: VERY SMALL QUAD FLAT PACKAGE (VQFP)
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Posted in 1.TestProbe, RU
Tagged r130-0, r176-0, r208-2, test probe, very small quad flat package, VQFP
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