1.TestProbe-Package04-LeadlessChipCarrier

Burn In Test Probe
Package#04: Leadless Chip Carrier (H-LCC)
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1.TestProbe-Package03-DTO

Burn In Test Probe
Package #03: D-TO
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1.TestProbe-Package02-Flatpack

Burn In Test Probe
Package #02: FLATPACK (C_FP)
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1.TestProbe-Package01-DualInLine

Burn In Test Probe
Package #01: DUAL IN LINE01(A_DIP)
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Protected: Patent#006: Non-abrasive electrical test contact

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Protected: Patent#005: Probe for integrated circuit test socket

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Protected: Patent#004: Socket contact with kelvin contact for testing integrated circuit devices

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Protected: Patent#003: Electrical contactor for testing integrated circuit devices

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Protected: Patent#002: Connector contact fingers for testing integrated circuit packages

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Protected: Patent#001: Apparatus for facilitating zero-insertion of a burn-in test probe into a socket

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