Category Archives: RU
1.TestProbe-Package04-LeadlessChipCarrier
Burn In Test ProbePackage#04: Leadless Chip Carrier (H-LCC).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package03-DTO
Burn In Test ProbePackage #03: D-TO.Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package02-Flatpack
Burn In Test ProbePackage #02: FLATPACK (C_FP).Product Pictures To request for more specification, please contact us here.
1.TestProbe-Package01-DualInLine
Burn In Test ProbePackage #01: DUAL IN LINE01(A_DIP). Product Pictures To request for more specification, please contact us here.
Protected: Patent#006: Non-abrasive electrical test contact
There is no excerpt because this is a protected post.
Protected: Patent#005: Probe for integrated circuit test socket
There is no excerpt because this is a protected post.
Protected: Patent#004: Socket contact with kelvin contact for testing integrated circuit devices
There is no excerpt because this is a protected post.
Protected: Patent#003: Electrical contactor for testing integrated circuit devices
There is no excerpt because this is a protected post.
Protected: Patent#002: Connector contact fingers for testing integrated circuit packages
There is no excerpt because this is a protected post.
Protected: Patent#001: Apparatus for facilitating zero-insertion of a burn-in test probe into a socket
There is no excerpt because this is a protected post.