Contact Finger
Package #52: TESTMAX Design
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Product Pictures
Note: Johnstech and Johnstech logos are trademarks of Johnstech International (http://www.johnstech.com/). All rights reserved.
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V2CF52: TESTMAX Design (40 amp @ 1msec)
Posted in 2.ContactFinger, RU
Tagged 0.3mm pitch, Contact Finger, dz12-80, dz48-56, high current, pitch 0.3mm, testmax design, true kelvin, wafer bump testing
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V2CF99: Custom Built
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Package #99: Custom Built
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, custom built package, ge1-146, ge1-147, ge1-198, ge3-1, ge3-178, ge5-124, ge8-32
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V2CF48: SIMEGA
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Package #48: SIMEGA
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Important Note: Please refer to DZ Series Contact finger for the upgraded version of this IC Handler (Click Here).
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Product Pictures (Click on photo for higher resolution).
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To request for more specification, please contact us here.
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Tagged Contact Finger, dv5-5, simega, simega package
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V2CF45: WTS / MCT
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Package #45: WTS / MCT
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, ds36-4, ds50-5, mct, mct package, wts, wts package
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V2CF42: ASA
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Package #42: ASA
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Product Pictures (Click on photo for higher resolution).
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Tagged asa, asa package, Contact Finger, dp16-40
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V2CF40: JOHNSTECH
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Package #40: JOHNSTECH
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, dn1-1, dz48-56, johnstech, johnstech package
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V2CF39: SOWA
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Package #39: SOWA
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, dm3-0, sowa, sowa package
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V2CF37: MHA / RASCO
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Package #37: MHA / RASCO
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, dk16-0, dk3-50, dk8-38, MHA, mha package, rasco, rasco package
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V2CF34: WELLEGION
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Package #34: WELLEGION
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, dh1-22, dh8-24, wellegion, wellegion package
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V2CF33: MIT
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Package #33: MIT
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Product Pictures (Click on photo for higher resolution).
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Tagged Contact Finger, dg22-1, mit, mit package
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