Category Archives: RU

V2TP12: PIN GRID ARRAY (PGA)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #12: Pin Grid Array (PGA).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged n84-1, pga, pga package, pin grid array, test probe | Comments Off

V2TP11: SMALL OUTLINE J LEAD (SOJ)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #11: SMALL OUTLINE J LEAD (SOJ).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged m16-1, m20-3, m28-0, m28-18, m32-1, m40-5, m40-6, small outline j lead, SOJ, test probe | Comments Off

V2TP10: SMALL OUTLINE IC (SOIC)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #10: SMALL OUTLINE IC (SOIC).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged k16-1, k16-3, k34-1, small outline IC, SOIC, test probe | Comments Off

V2TP09: PLASTIC LEADLESS CHIP CARRIER (PLCC)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #01: PLASTIC LEADLESS CHIP CARRIER (PLCC).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged j10-0, j100-0, j100-2, j12-1, j22-0, j22-2, j22-5, j28-4, j44-0, j44-1, j44-1m-2, j52-12, j68-0, j68-11, j68-15, j68-3, j68-5, j68-6, j84-0, leadless chip carrier, plcc package, test probe | Comments Off

V2TP08: LEADLESS CHIP CARRIER (LCC)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #01: LEADLESS CHIP CARRIER (LCC).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged h18-1, h18-3, h20-1, h28-8, h32-2, h32-3, h32-5, h32-8, h40-4, h44-3, h52-0, h68-5, lcc package, leadless chip carrier, test probe | Comments Off

V2TP04: TO

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #04: TO.Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged d12-6, d4-7, test probe, to package | Comments Off

V2TP03: FLATPACK (FP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #03: FLATPACK (FP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged c14-1, c20-5, c26-5, c30-2, c56-2, c68-2, flatpack, fp package, test probe | Comments Off

V2TP01: DUAL IN LINE 0.1″ (DIP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #01: DUAL IN LINE (DIP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged a24-2, a40-2, dip package, dual in line, test probe | Comments Off

New Multitest Contact Finger Ck1-441-00 added

Posted on September 9, 2009 by admin

To request for more specification, please contact us here.

Posted in News, RU, Sticky | Tagged ck1-441, Contact Finger, multitest | Comments Off

New Contact Finger and Test Sockets Update

Posted on June 25, 2009 by admin

Test Max is please to launch its new Contact Fingers and Test Sockets specially designed with the following features: 1) Small and Compact2) Fine Pitch of 0.3mm with True kelvin included . High Current (17 Ampere @ 3mSec. >High, 200mSec … Continue reading →

Posted in News, RU, Sticky | Comments Off

Category Archives: RU

V2TP12: PIN GRID ARRAY (PGA)

V2TP11: SMALL OUTLINE J LEAD (SOJ)

V2TP10: SMALL OUTLINE IC (SOIC)

V2TP09: PLASTIC LEADLESS CHIP CARRIER (PLCC)

V2TP08: LEADLESS CHIP CARRIER (LCC)

V2TP04: TO

V2TP03: FLATPACK (FP)

V2TP01: DUAL IN LINE 0.1″ (DIP)

New Multitest Contact Finger Ck1-441-00 added

New Contact Finger and Test Sockets Update

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