Author Archives: admin

V2CF04: EMS

Posted on October 8, 2009 by admin

Contact Finger Package #04: EMS.Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 2.ContactFinger, RU | Tagged cd14-22, cd14-50, cd15-5, cd20-46, cd24-26, Contact Finger, ems, EMS Package | Comments Off

V2CF03: TEXAS

Posted on October 8, 2009 by admin

Contact Finger Package #03: TEXAS.Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 2.ContactFinger, RU | Tagged cc14-1, Contact Finger, texas, TEXAS package | Comments Off

V2CF02: VEHEM

Posted on October 8, 2009 by admin

Contact Finger Package #02: VEHEM.Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 2.ContactFinger, RU | Tagged cb-16-2, cb16-28, Contact Finger, vehem, vehem package | Comments Off

V2CF01: MCT

Posted on October 7, 2009 by admin

Contact Finger Package #01: MCT.Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 2.ContactFinger, RU | Tagged ca0-23, ca1-1, ca1-2, ca10-3, ca10-47, ca10-85, ca12-163, ca14-134, ca16-91a, ca21-172, ca4-86, ca5-117, ca5-2, ca7-167, ca7-56, ca8-9, Contact Finger, mct, mct package | Comments Off

V2TP22: BALL GRID ARRAYS (BGA)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #22: BALL GRID ARRAYS (BGA).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged ball grid arrays, bga package, test probe, y456-1, y48-0, y54-0 | Comments Off

V2TP19: THIN SOP (TSOP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #19: THIN SOP (TSOP).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged test probe, thin sop, tsop package, v32-6, v40-4, v40-5, v50-5 | Comments Off

V2TP18: TAPE AUTOMATED BONDING (TAB)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #18: TAPE AUTOMATED BONDING (TAB).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged tab package, tape automated bonding, test probe, u192-2, u256-1, u80-1 | Comments Off

V2TP17: CERAMIC LEADED CHIP PACKAGE (CLCC)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #17: CERAMIC LEADED CHIP PACKAGE (CLCC).Product Pictures (Click on photo for higher resolution).. To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged ceramic leaded chip, clcc, t50-5, test probe | Comments Off

V2TP16: QUAD FLAT PACKAGE (QFP)

Posted on September 22, 2009 by admin

Burn In Test Probe Package #16 QUAD FLAT PACKAGE (QFP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged qfp package, quad flat package, s100-29, s100-46, s132-9, s136-1, s144-4, s160-19, s160-8, s208-8, s50-5, s64-16, s80-12, test probe | Comments Off

V2TP15: VERY SMALL QUAD FLAT PACKAGE (VQFP)

Posted on September 22, 2009 by admin

Burn In Test ProbePackage #15: VERY SMALL QUAD FLAT PACKAGE (VQFP).Product Pictures To request for more specification, please contact us here.

Posted in 1.TestProbe, RU | Tagged r130-0, r176-0, r208-2, test probe, very small quad flat package, VQFP | Comments Off

Author Archives: admin

V2CF04: EMS

V2CF03: TEXAS

V2CF02: VEHEM

V2CF01: MCT

V2TP22: BALL GRID ARRAYS (BGA)

V2TP19: THIN SOP (TSOP)

V2TP18: TAPE AUTOMATED BONDING (TAB)

V2TP17: CERAMIC LEADED CHIP PACKAGE (CLCC)

V2TP16: QUAD FLAT PACKAGE (QFP)

V2TP15: VERY SMALL QUAD FLAT PACKAGE (VQFP)

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