Daily Archives: September 22, 2009
V2TP08: LEADLESS CHIP CARRIER (LCC)
Burn In Test Probe Package #01: LEADLESS CHIP CARRIER (LCC).Product Pictures To request for more specification, please contact us here.
Posted in 1.TestProbe, RU
Tagged h18-1, h18-3, h20-1, h28-8, h32-2, h32-3, h32-5, h32-8, h40-4, h44-3, h52-0, h68-5, lcc package, leadless chip carrier, test probe
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V2TP04: TO
Burn In Test ProbePackage #04: TO.Product Pictures To request for more specification, please contact us here.
V2TP03: FLATPACK (FP)
Burn In Test Probe Package #03: FLATPACK (FP).Product Pictures To request for more specification, please contact us here.
Posted in 1.TestProbe, RU
Tagged c14-1, c20-5, c26-5, c30-2, c56-2, c68-2, flatpack, fp package, test probe
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V2TP01: DUAL IN LINE 0.1″ (DIP)
Burn In Test Probe Package #01: DUAL IN LINE (DIP).Product Pictures To request for more specification, please contact us here.
Posted in 1.TestProbe, RU
Tagged a24-2, a40-2, dip package, dual in line, test probe
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