Burn-in Test Probes
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CONTACT MATERIALS :
(a) Cannot be easily soldered
(b) Conductive within Military Standard 883C
(c) Will not oxidize so no gold platting is required
(d) Harder than beryllium copper and can withstand longer wear and tear
(e) Kelvin contact concept
PROBES PHYSICAL :
(a) Molded design for all packages
(b) Presentable
(c) Compact
(d) Easy handling
(e) Easy attachable wire
(f) No tooling charge for special packages
(g) No peeling problem
WIDER RANGE AND NO ENGINEERING :
(a) Can make probes that meets customers’ requirements
(b) No engineering charge involved even for special packages
(c) Can meet accuracy of fine pitch probes due to molding process
FLATPACKAGES :
(a) Material of stainless steel or alloy
(b) Correct simulation
(c) If probe wear out after numerous insertions, contact material can be reused
VERY SMALL QUAD :
(a) Use double contact concept
(b) Correct simulation with 5 mil extra of protruding pins so as to acheive double contact concept
LEADLESS/PLASTIC :
(a) 75% of pins are molded together with body to avoid peeling of pins 25% of pins are miled out
(b) Correct simulation act like DEVICE.
TAP PACK :
(a) Can make all types of probes for this package
(b) Can meet very tight tolerance due to molded design
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